This document describes the features and characteristics of Chip Beads(SMD) For Signal Line MMZ Series MMZ2012 Type, including 4 construction materials, standardized size for automatic assembly equipment, availability of flow or reflow soldering methods, high reliability of monolithic structure, closed magnetic circuit structure to prevent crosstalk between circuits, low DC resistance structure to prevent wasteful electric power consumption. The products are lead-free and comply with RoHS directive.
The MMZ2012 series of chip beads (SMD) is designed for signal‑line applications such as personal computers, printers, LCD panels and cellular phones. It offers four construction materials, a closed magnetic circuit for high‑density installation, low DC resistance and lead‑free, RoHS‑compliant construction.
The document includes handling precautions, recommended soldering conditions, detailed electrical characteristics (impedance, DC resistance, rated current), material options, and packaging information such as tape style and reel quantities.
| Nominal impedance | 121:1200 at 100 MHz |
|---|---|
| Impedance (example part) | 15 Ω |
| DC resistance (example part) | 0.05 Ω |
| Rated current (example part) | 1500 mA |
| Operating temperature range | 55 °C to +125 °C |
| Packaging quantity (tape) | 4000 pieces/reel |
The soldering iron tip temperature should not exceed 350 °C.
Yes, it conforms to the RoHS directive.