SAMSUNG SDRAM 128Mb F-die (x4 x8 x16)handbook

This document is a technical specification for K4S280432F/K4S280832F/K4S281632F, which introduces the features and characteristics of the product, including storage capacity, interface, package, etc.


SAMSUNG SDRAM 128Mb F-die (x4 x8 x16)handbook - cover page
Brand
Samsung
Category
Other Electronics
Document type
Datasheet
Language
English
Pages
14
File format
PDF
File size
162 KB
Published
01 April, 2012
Updated
30 September, 2023
Model
X16
MD5 checksum
F0D78AF6F3705FE2C074AC8E4104813E

About this manual

This document provides the preliminary specifications for Samsung's 128 Mb F‑die CMOS SDRAM devices, covering the x4, x8 and x16 configurations. It includes features, organization, package details, pin configuration, absolute maximum ratings and detailed DC operating conditions.

The datasheet also contains functional block diagrams, timing tables, clamp current characteristics and a simplified truth table for command decoding, enabling designers to integrate the memory into high‑performance systems.

What's inside

  • Features
  • General Description
  • Ordering Information
  • Package Physical Dimension
  • Functional Block Diagram
  • Pin Configuration
  • Absolute Maximum Ratings
  • DC Operating Conditions
  • Capacitance
  • Simplified Truth Table

Specifications

Supply voltage (VDD, VDDQ)3.0 V min / 3.3 V typ / 3.6 V max
Operating temperature range-55 °C to +150 °C
Package type54‑pin TSOP
Refresh period64 ms (4K cycle)

Frequently asked questions

What is the supply voltage range for the SDRAM?

The device operates with a supply voltage of 3.0 V minimum, 3.3 V typical, and 3.6 V maximum.

What temperature range can the SDRAM operate in?

It is rated for storage temperatures from –55 °C up to +150 °C.

Which package does the 128 Mb F‑die SDRAM use?

The memory is supplied in a 54‑pin TSOP package.

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