This document provides information about the PC board occupied area and soldering information for the SOT375-1 package from Philips Electronics N.V. in 2004. The package is suitable for TQFP80 and includes detailed information about the dimensions and layout of the soldering pads.
This document provides the PCB footprint dimensions required for reflow soldering of the Philips SOT375-1 TQFP80 package. It lists the generic footprint pattern and the specific coordinate values for each pad and land.
All dimensions are expressed in millimetres. For the exact layout, refer to the package outline drawing included in the full component datasheet.
It applies to the TQFP80 package.
All dimensions are provided in millimetres.