This document provides information on the PC board dimensions for the SOT314-2 package by Philips Electronics N.V. It is specifically for reflow soldering of the LQFP64 package.
This document provides the PCB footprint data required for reflow soldering the Philips SOT314-2 LQFP64 semiconductor package. It includes pad dimensions, spacing, and the generic footprint pattern.
The listed dimensions are given in millimetres and should be used together with the package outline drawing for the final layout. The footprint is intended for standard reflow processes and complies with Philips' design rules.
| Pad pitch (P2) | 0.125 mm |
|---|
The pad pitch is 0.125 mm.