This is a PDF file about SOT804-1. This file contains the product's size, occupied area, soldering information, etc.
This document provides the printed‑circuit‑board (PCB) footprint details for the Philips SOT804-1 HVQFN64 semiconductor package. It includes the generic footprint pattern, pad dimensions, and solder paste guidelines needed for accurate reflow soldering.
The layout references the package outline drawing for the exact geometry, and a table lists key dimensions such as pad pitch, pad length, and solder land sizes in millimetres.
It applies to the HVQFN64 package SOT804-1.
Refer to the package outline drawing for the actual layout.