This technical bulletin details the specifications, process guidelines, and safety information for the ALPHA CVP-520 low melting point, lead-free…
The ALPHA CVP-520 is a low melting point, no-clean, lead-free, and completely halogen-free solder paste designed for low-temperature surface mount applications. Its lead-free alloy has a melting point below 140°C, making it suitable for peak reflow profiles between 155°C and 190°C. The flux residue is colorless and transparent with high resistivity, offering excellent resistance to thermal cycling cracking. It is compatible with nitrogen or air reflow processes and helps reduce energy consumption and production costs by eliminating the need for selective wave soldering steps. This manual is written in Chinese.
| Alloy Composition | 42%Sn/57.6%Bi/0.4%Ag |
|---|---|
| Melting Point | Below 140°C |
| Peak Reflow Temperature | 155 - 190°C |
| Flux Residue Color | Colorless transparent |
| Powder Size | 3, 4, and 5 mesh |
| Residue Weight | Approximately 5% |
| Packaging | 500g can; 6" and 12" sticks |
| Halogen Content | Halogen-free |
| RoHS Compliance | Compliant |
The lead-free alloy melting point is below 140°C.
Yes, it is a lead-free solder paste.
It should be stored in a refrigerator at 0 - 10°C (32 - 50°F).