Technical bulletin for Alpha CVP-390, a halogen-free, no-clean lead-free solder paste compatible with SAC alloys and offering excellent voiding performance.
The ALPHA CVP-390 is a lead-free, completely halogen-free no-clean solder paste designed for applications requiring excellent in-circuit testability of solder residues and compliance with JIS standard copper corrosion tests. It is suitable for SAC305, SAC405, and low-silver alloys, offering superior printing performance, voiding characteristics, and in-circuit testing attributes. This manual is written in Chinese.
| Alloy Compatibility | SAC105, SAC305, SAC405, SACX Plus 0307 SMT, SACX Plus 0807 SMT, Innolot |
|---|---|
| Powder Size Options | 3号粉、4 号粉、4.5号粉、5号粉、6号粉及 7号粉 |
| Halogen Content | Completely halogen-free (no intentionally added halogens) |
| Voiding Performance | IPC-7095 Standard Class 3 |
| Recommended Solder Paste Diameter | 180 µm round print |
| Stencil Thickness Recommendation | 0.100mm - 0.150mm (4 – 6 mil) |
| Recommended Reflow Peak Temperature | 235 – 245 °C |
Yes, it is completely halogen-free with no intentionally added halogens.
The recommended stencil thickness is between 0.100mm and 0.150mm.
Yes, the material complies with RoHS and halogen-free requirements.