Technical bulletin for Alpha CVP-380, a halogen-free, lead-free solder paste designed for fine-pitch applications and modern handheld devices.
The Alpha CVP-380 is a lead-free, completely halogen-free, no-clean solder paste specifically designed for modern handheld devices requiring high impact resistance. It is also suitable for other applications with many fine-pitch features. The product offers stable printing performance on screens up to 80µm thick and excellent reflow reliability.
| Alloy Composition | SAC305 (96.5%Sn/3.0%Ag/0.5%Cu) |
|---|---|
| Powder Size | #3, #4, #5, #6 |
| Halogen Content | Completely Halogen Free |
| Electrical Reliability Class | ROL0 |
| RoHS Compliance | Yes (RoHS Directive 2002/95/EC) |
| Recommended Screen Thickness | 0.100mm - 0.150mm (0.004" - 0.006") |
| Recommended Squeegee Pressure | 0.22-0.27 kg/cm² (1.25 -1.5 lb/inch) |
| Recommended Reflow Peak Temp | 230-245 °C (preferably < 240°C) |
Yes, it is completely free of halogens.
It should be stored in a refrigerator at 0-10 °C (32-50 °F) to ensure stability.
The typical peak temperature is 230-245 °C, though it is preferable to keep it below 240°C.