This document is an instruction manual for the KYOCERA ELCO Corporation Series 5801 0.4mm Pitch B to B Connector. The product was developed to meet the market's demand for higher mountability. The document includes information on the parts names, model numbers, and matters to be noted in use of the product.
This manual describes the Series 5801 board‑to‑board connector, a 0.4 mm pitch B‑to‑B connector with a height of 0.8 mm, developed for high‑density applications. It lists part names, model numbers, and variations such as plating types.
The document gives detailed mounting instructions, recommended PCB pad and stencil dimensions, and cautions for soldering to avoid flux contamination and mechanical stress. It also includes recommended solder volume to prevent short‑circuits and guidance on using reinforcing boards for FPC applications.
| Pitch | 0.4 mm |
|---|---|
| Height | 0.8 mm |
| Pad size (signal contact) | 0.23 mm (9 mil) |
The Series 5801 connector uses a 0.4 mm pitch.
The recommended pad size for the signal contact is 0.23 mm (9 mil).
Do not apply flux to the tail or PCB when soldering manually, and avoid stressing the part with the soldering iron.