Altera High-Speed Board Design Advisor Thermal Management Manual

This document introduces how to use Altera's Stratix II GX FPGA for thermal design


Altera High-Speed Board Design Advisor Thermal Management Manual - cover page
Brand
Altera
Category
Other Electronics
Document type
User Manual
Language
English
Pages
6
File format
PDF
File size
68 KB
Published
01 August, 2012
Updated
30 September, 2023
MD5 checksum
4334C5849BDA4397AC0FC7CDDA4F4F95

About this manual

This document provides a step-by-step tutorial and checklist to support users in designing and reviewing thermal designs for Stratix II GX FPGAs. It outlines the process of specifying operating conditions, estimating power consumption, and determining the necessity of a cooling solution. The guide assumes familiarity with the Stratix II GX Handbook and the PowerPlay Early Power Estimator (EPE) Spreadsheet.

What's inside

  • Introduction
  • Specifying the Operating Conditions
  • Estimate the Total Power Consumption
  • Determine the Necessity of a Cooling Solution
  • Select Cooling Solution
  • Validate the Cooling Solution
  • Junction Temperature and Tjmax
  • Thermal Resistance Values
  • Guidance to Select a Cooling Solution
  • Power Analysis

Frequently asked questions

At what junction temperature does the tool indicate a cooling solution is required?

The calculated junction temperature turns red when it exceeds 85°C for commercial grade or 100°C for industrial grade.

What airflow rates are available as standard options in the EPE tool?

The standard airflow options are 100 lfm, 200 lfm, and 400 lfm.

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