Altera PCN 0902 Additional Assembly Source Bill of Material Change Notification

Altera Corporation 1 PCN0902 Product Change Notification, Altera flip-chip packages will have a new assembly factory and new component materials

Brand: Altera
Category: Other Electronics
Document type: Service Manual
Language: English
Pages: 12
File format: PDF
File size: 620 KB
Published: 01 August, 2012
Updated: 01 October, 2023
MD5 checksum: A2DA74C0626286C616558BA04AB98E6B
PDF: Altera PCN 0902 Additional Assembly Source Bill of Material Change Notification PDF

About this manual

This document serves as a Process Change Notification (PCN) regarding updates to the manufacturing process for Altera flip-chip packages. It confirms that Amkor Technology Taiwan has been qualified as an additional assembly site alongside existing sites, and outlines specific changes to construction materials including the transition from high lead to eutectic bump composition and from two-piece to single-piece lids.

What's inside

Change Description
Recommended Action
Reason for Change
Products Affected
Summary of current vs. standardized bill of material
Product Traceability and Transition Dates
Qualification Data

Specifications

Assembly Site Change	Amkor Technology Taiwan (AHT) added as primary assembly site for indicated products
Bump Composition Change	Conversion from high lead (Pb) to eutectic bump composition
Reflow Temperature Support	260° C reflow temperatures required by JEDEC to support Pb-free manufacturing
Implementation Start Date	July 2009

Frequently asked questions

Will this change affect the fit or function of the devices?

No, this change does not affect the fit or function of the devices.

What is the moisture sensitivity rating level for these products?

There is no change in the current moisture sensitivity rating levels per JEDEC J-STD-020D.

How can customers verify if a product has the new materials?

Customers may look for a date-code marking of 0925 or later on the top of the package.

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