This application note presents the thermal model of LTM4600 DC/DC μModule regulator. The model includes thermal resistance from junction to top surface, from top surface to ambient, and the double-sided cooling scheme.
The document provides a guideline for using the LTM4600 DC/DC uModule regulator in ambient environments with or without air flow. It details three specific test cases: operation with no heatsink, operation with a surface mount BGA heatsink, and operation mounted to a metal plate via a thermal conductive pad.
| Load Current (Continuous) | 10A |
|---|---|
| Package Dimensions | 15mm x 15mm x 2.8mm |
| Junction-to-Ambient Thermal Resistance (No Heatsink) | 15.2°C/W |
| Junction-to-Ambient Thermal Resistance (BGA Heatsink) | 13.9°C/W |
| Junction-to-Ambient Thermal Resistance (Metal Plate) | 12°C/W |
The device has two voltage options: 20V maximum for the LTM4600EV and 28V maximum for the LTM4600HVEV.
The device supports a continuous load current of 10A.
The regulator is housed in a 15mm x 15mm x 2.8mm LGA surface mount package.
The LTM460EV has a maximum output voltage of 20V.