Linear Technology LTM4601 DC/DC uModule Regulator Thermal Performance Application Note 110

Introduces the thermal design of LTM4601 DC/DC μModule regulator, including thermal model and temperature rise analysis with/without a heatsink.

Brand: Linear Technology
Category: Other Electronics
Document type: Application Note
Language: English
Pages: 8
File format: PDF
File size: 189 KB
Published: 05 June, 2012
Updated: 30 September, 2023
Model: LTM4601
MD5 checksum: CB2064031451CD56D748CF771997290B
PDF: Linear Technology LTM4601 DC/DC uModule Regulator Thermal Performance Application Note 110 PDF

About this manual

The document analyzes the thermal characteristics of the LTM4601 step-down regulator in a 15mm x 15mm x 2.8mm LGA package, focusing on power dissipation challenges up to 12A continuous loads. It presents a simplified 1-D thermal model to calculate heat paths from the junction through the package and PCB to ambient environments.

What's inside

Introduction
Thermal Model
Thermal Imaging
Case 1: No Heatsink
Case 2: With A BGA Heatsink
Case 3: With A Metal Plate
Derating Curves
Conclusion

Specifications

Continuous Load Current	12A
Package Dimensions	15mm x 15mm x 2.8mm
Maximum Junction Temperature	125°C
Case Temperature Limit	100°C

Frequently asked questions

What is the junction-to-ambient thermal resistance without a heatsink?

The total thermal resistance from junction to ambient in this case is only 14.3°C/W.

What is the junction-to-ambient thermal resistance with a BGA heatsink?

The total junction-to-ambient thermal resistance for this scenario with a BGA heatsink is about 12°C/W.

What is the junction-to-ambient thermal resistance when mounted to a metal plate?

The total thermal resistance from junction to ambient in this situation is about 10.7°C/W.

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