This document describes the features and characteristics of the 1SMB3EZ11 to 1SMB3EZ200 series surface mount silicon zener diodes, including low profile package, glass passivated junction, low inductance, excellent clamping capability, etc.
The document describes the PanJit 1SMB3EZ series of surface-mount silicon zener diodes designed for applications requiring low profile packages and excellent clamping capability. These devices feature a JEDEC DO-214AA molded plastic package with built-in strain relief and are rated for power dissipation up to 3.0 Watts.
| Power Dissipation | 3.0 Watts |
|---|---|
| Operating Junction Temperature Range | -55 to +150 C |
| Package Type | JEDEC DO-214AA |
| Voltage Range | 11 to 200 Volts |
The maximum peak pulse power dissipation is 3 Watts when mounted on 5.0mm land areas.
The typical lead inductance is less than 9 nH above 11V.
The standard packaging format is a 12mm tape following EIA-481.