The TS3USB30 is a high-bandwidth switch chip designed by TI company. It is mainly used in mobile phones, digital cameras, notebooks and other consumer electronic devices to realize the switching of USB 1.0, 1.1 and 2.0 signals. The TS3USB30 has a bandwidth of up to 750 MHz, which can realize fast signal transmission with low crosstalk and noise.
The TS3USB30 is a high‑bandwidth switch designed for routing USB 1.0, 1.1 and 2.0 signals in handheld and consumer devices such as cell phones, digital cameras and notebooks. It multiplexes differential outputs from a USB host to one of two downstream ports, operates bidirectionally, and provides low attenuation, low skew and strong noise isolation.
Key electrical characteristics include a supply voltage range of 3 V to 4.3 V, a -3 dB bandwidth of 955 MHz, on‑state switch current of 64 mA, propagation delay of 0.25 ns, and line enable/disable times of 30 ns/25 ns. The device is offered in a 10‑pin TQFN package (1.4 mm × 1.8 mm) and meets JESD‑based ESD and reliability standards.
| Supply voltage (Vcc) | 3 V to 4.3 V |
|---|---|
| -3 dB Bandwidth | 955 MHz |
| Package | 10‑pin TQFN (1.4 mm × 1.8 mm) |
| On‑state switch current | 64 mA |
It operates from 3 V up to 4.3 V.
The device provides a -3 dB bandwidth of 955 MHz.
It is supplied in a 10‑pin TQFN package measuring 1.4 mm × 1.8 mm.