This is a PDF file, about package outline drawings of Philips Semiconductors products
The handbook from Philips Semiconductors contains detailed outline drawings for a wide range of integrated circuit packages. It includes an index and descriptions for each package type, such as DIP, SOT, SSOP, and TSSOP families.
Each entry lists the number of leads, body width, and dimensional data in both millimetres and inches, along with notes on allowable protrusions. The document serves as a reference for designers and manufacturers needing precise package specifications.
| DIP14 lead count | 14 leads |
|---|---|
| SOT96-1 body width | 3.9 mm |
| TSSOP20 body width | 4.4 mm |
The maximum allowed plastic or metal protrusion is 0.25 mm per side.