The TIBPAL16L8-25C, TIBPAL16R4-25C, TIBPAL16R6-25C, TIBPAL16R8-25C TIBPAL16L8-30M, TIBPAL16R4-30M, TIBPAL16R6-30M, TIBPAL16R8-30M are low-power, high-performance IMPACT PAL circuits that combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. These circuits are easy to program and can quickly design custom functions, typically resulting in a more compact circuit board. In addition, chip carriers are available for further reduction in board space. The TIBPAL16' C series is characterized by its high speed and functional equivalency, making it an ideal replacement for current available devices.
The TIBPAL16R series includes low‑power, high‑performance IMPACT™ PAL devices offered in both 25C (commercial) and 30M (military) temperature grades. The devices feature fast propagation delays, with 25 ns max for C‑suffix parts and 30 ns max for M‑suffix parts, and are built using Advanced Low‑Power Schottky technology.
Package options include plastic and ceramic chip carriers as well as ceramic DIP packages. The datasheet also contains production data, availability status (ACTIVE, LIFEBUY, NRND, etc.), and legal notices regarding warranties and patents.
| Commercial temperature range (C series) | 0 °C to 75 °C |
|---|---|
| Military temperature range (M series) | -55 °C to 125 °C |
| Maximum propagation delay (C suffix) | 25 ns |
| Maximum propagation delay (M suffix) | 30 ns |