MicroPak and MicroPak II packages are the world's smallest packages for single-, dual-, and triple-gate logic. They are 65% - 74% smaller than their PicoGate equivalents and offer a larger pad size that provides a more rugged and reliable bond between the device and the PC board.
The MicroPak and MicroPak II packages are the world’s smallest leadless logic solutions for single‑, dual‑, and triple‑gate functions. They are 65%‑74% smaller than comparable PicoGate packages and provide up to 40% larger pad areas, improving mechanical strength and reliability.
These packages support standard pad pitches of 0.5 mm and 0.35 mm, operate from –40 °C to +125 °C, and are Pb‑free and RoHS compliant. Typical applications include mobile phones, PDAs, laptops, digital cameras, MP3 players, and handheld test equipment, where board space is critical.
| Six‑pin MicroPak package size | 1.0 × 1.45 × 0.5 mm |
|---|---|
| Temperature range | -40 °C to +125 °C |
| Pad pitch | 0.5 mm and 0.35 mm |
| Pad size increase vs. WCSP | 40 % larger |
| Environmental compliance | Pb‑free, RoHS compliant |
MicroPak and MicroPak II are 65%‑74% smaller than comparable PicoGate packages, with the six‑pin version being 65% smaller and the MicroPak II version 33% smaller than the original MicroPak.
The leadless format eliminates assembly problems caused by bent or non‑planar leads and provides a more rugged, reliable bond between the die and the PCB.