This document describes Kingston's KHX1866C9D3K4/16GX product, which is a kit of four 512M x 64-bit (4GB) DDR3-1866 CL9 SDRAM (Synchronous DRAM) 2Rx8 memory modules. Each module kit supports Intel® XMP (Extreme Memory Profiles). The total kit capacity is 16GB. Each module kit has been tested to run at DDR3-1866 with a low latency timing of 9-11-9 at 1.65V. The SPDs are programmed to JEDEC standard latency DDR3-1333 timing of 9-9-9 at 1.5V. Each 240-pin DIMM uses gold contact fingers. The JEDEC standard electrical and mechanical specifications are provided.
The Kingston KHX1866C9D3K4/16GX kit consists of four 4 GB DDR3‑1866 CL9 240‑pin DIMM modules, each built to JEDEC standards and featuring gold‑plated contacts and a heat spreader. The modules support Intel® XMP profiles for easy performance tuning and are designed for reliable operation in a range of desktop and workstation environments.
Technical specifications include a CAS latency of 9 cycles, operating voltage of 1.5 V, power consumption of about 1.410 W per module, and operating temperature limits from 0 °C to 85 °C. Detailed mechanical dimensions and thermal characteristics are provided for system integrators.
| Capacity | 16 GB (4 GB per module) |
|---|---|
| Type | DDR3‑1866 CL9 240‑Pin DIMM Kit |
| CAS Latency | CL9 cycles |
| Row Cycle Time (tRCmin) | 49.5 ns |
| Row Active Time (tRASmin) | 36 ns |
| Operating Power | 1.410 W per module |
| Operating Temperature | 0 °C to 85 °C |
| Storage Temperature | -55 °C to +100 °C |
| Voltage | 1.5 V (JEDEC standard) |
| Module Dimensions | 133.35 mm × 30.00 mm × 18.80 mm |
The kit provides a total of 16 GB of memory, with four 4 GB modules.
The modules operate safely between 0 °C and 85 °C.
Yes, each module kit supports Intel® XMP (Extreme Memory Profiles).
Each module consumes approximately 1.410 W of power.