This is a Kingston KHX1333C7D3K3/6GX 6GB memory module specification document, supporting DDR3-1333MHz CL7 240-Pin DIMM kit, based on 16 128M x 8-bit DDR3 FBGA components per module, each kit supports Intel® XMP (Extreme Memory Profiles), total kit capacity is 6GB. Each pair of modules has been tested to run at DDR3-1333MHz at a low latency timing of 7-7-7-20 at 1.65V. The SPDs are programmed to JEDEC standard latency DDR3-1333MHz timing of 9-9-9 at 1.5V. Each 240-pin DIMM uses gold contact fingers and requires +1.5V.
The KHX1333C7D3K3/6GX kit consists of three 2 GB DDR3‑1333 MHz CL7 240‑pin DIMM modules, each built from sixteen 128 M×8‑bit DDR3 FBGA components. The modules support Intel XMP profiles and are rated for a low‑latency timing of 7‑7‑7‑20 at 1.65 V, while the SPD programming follows the JEDEC 9‑9‑9 standard at 1.5 V.
Each module consumes 1.800 W of power, operates between 0 °C and 85 °C, and can be stored from –55 °C to +100 °C. Features include eight independent internal banks, 8‑bit pre‑fetch, burst length of 8, and programmable CAS latencies (5‑10). The modules use gold‑contact fingers and require a standard 1.5 V supply with an additional 0.075 V VDDQ offset.
| Total capacity | 6 GB |
|---|---|
| Module type | 240‑pin DIMM |
| Memory speed | DDR3‑1333 MHz |
| CAS latency (low‑latency mode) | 7‑7‑7‑20 |
| JEDEC standard latency | 9‑9‑9 |
| Operating voltage | 1.5 V |
| Power per module | 1.800 W |
| Operating temperature | 0 °C to 85 °C |
| Storage temperature | -55 °C to +100 °C |
| Number of internal banks | 8 |
| Prefetch size | 8‑bit |
| Burst length | 8 |
| VDDQ voltage | 1.5 V + 0.075 V |
The kit provides a total capacity of 6 GB.
Each 240‑pin DIMM requires a standard +1.5 V supply.
The modules operate from 0 °C up to 85 °C.