This document provides power dissipation data for the USPN-4B02. It includes measurement conditions, such as board mount and ambient temperature, and presents the power dissipation versus ambient temperature graph.
This one‑page datasheet provides the power dissipation data for the Torex USPN-4B02. It lists the measurement conditions used to obtain the reference data, including board mounting, natural convection ambient, lead‑free soldering, and the board dimensions.
The document also describes the board layout (40 × 40 mm, 50 % copper on front and back, copper divided into four blocks), material (glass epoxy FR‑4, 1.6 mm thick), through‑hole size (4 × 0.8 mm), and presents a thermal‑resistance curve showing how power dissipation varies with ambient temperature.
| Board dimensions | 40 × 40 mm (1600 mm²) |
|---|---|
| Copper coverage | 50 % front, 50 % back; each block 12.5 % of total |
| Material | Glass Epoxy (FR‑4) |
| Board thickness | 1.6 mm |
| Through‑hole size | 4 × 0.8 mm |
The data were measured with the device mounted on a 40 × 40 mm FR‑4 board, natural convection ambient, lead‑free soldering, 1.6 mm board thickness, and copper covering 50 % of each side.