Introduces the power dissipation of USP-3, including power dissipation under different ambient temperatures and different circuit board conditions.
This one‑page document provides power dissipation values for the TOIREX USP-3 component measured on a standard board. The data are intended as reference for designers using the part in similar mounting conditions.
Measurements were taken with the device mounted on a 40 × 40 mm FR‑4 board, copper covering 50 % of the area, 1.6 mm thickness, and lead‑free solder. Ambient temperature ranged from 25 °C to 125 °C, with a reported thermal resistance of 100 °C/W and a maximum junction temperature of 125 °C.
| Board dimensions | 40 x 40 mm |
|---|---|
| Copper coverage | 50 % of board area |
| Board material | Glass Epoxy (FR‑4) |
| Board thickness | 1.6 mm |
| Maximum junction temperature | 125 °C |