This document mainly provides the power dissipation test data for USP-2B02
This page provides power‑dissipation data for the USP‑2B02 component measured under defined board‑mount conditions. The reference measurement conditions include mounting on a board with natural convection cooling, lead‑free soldering, a board size of 114.3 mm × 76.2 mm, copper trace area of 74.2 mm × 74.2 mm, FR‑4 glass‑epoxy material and a thickness of 1.6 mm.
A table lists ambient temperature versus power dissipation (Pd) and thermal resistance. For example, at 25 °C the device dissipates 110 mW, while at 85 °C it dissipates 44 mW, illustrating the inverse relationship between ambient temperature and power dissipation.
| Board dimensions | 114.3 mm x 76.2 mm |
|---|---|
| Copper trace area | 74.2 mm x 74.2 mm |
| Board material | Glass Epoxy (FR-4) |
| Board thickness | 1.6 mm |
| Soldering type | Lead (Pb) free |
| Cooling method | Natural convection |
The data were taken with the device mounted on a board, using natural convection cooling, lead‑free soldering, a board size of 114.3 mm × 76.2 mm, copper traces covering 74.2 mm × 74.2 mm, FR‑4 material and a thickness of 1.6 mm.