This document is about USP-2B01 product's packaging information and reference pattern layout dimensions.
This document provides power‑dissipation data for the TOIREX USP‑2B01 measured on a board with specific dimensions and material properties. The reference conditions include natural convection cooling, lead‑free soldering, and a FR‑4 substrate of 1.6 mm thickness.
The data include a table of ambient temperature versus power dissipation and thermal resistance, with a maximum junction temperature (Tjmax) of 125 °C.
| Board dimensions | 114.3mm x 76.2mm |
|---|---|
| Copper trace area | 74.2mm x 74.2mm |
| Material | Glass Epoxy (FR-4) |
| Board thickness | 1.6mm |
| Maximum junction temperature (Tjmax) | 125°C |
| Soldering type | Lead (Pb) free |
| Ambient cooling method | Natural convection |
The maximum junction temperature (Tjmax) is 125 °C.