Key facts
- Brand
- TOIREX
- Model
- USP-3
- Documents
- 3
- Languages
- EN
- Last added
- 2012-03-19
Start here
TOIREX USP-3 Manual(2)
User Manual
Specifications of USP-3 series products, including product type, product size, product quantity and other information
Read onlineTOIREX USP-3 specifications
| Board dimensions | 40 x 40 mm |
|---|---|
| Copper coverage | 50 % of board area |
| Board material | Glass Epoxy (FR‑4) |
| Board thickness | 1.6 mm |
| Maximum junction temperature | 125 °C |
All TOIREX USP-3 documents by type
User Manual 3
Day-to-day operation, settings and troubleshooting. Start here if the product is already set up.
Datasheet 2
Ratings, dimensions and ordering codes, for selection and design work.
Questions answered in these manuals
What are the measurement conditions for the USP‑3 power‑dissipation data?
The data were taken with the device mounted on a 40 × 40 mm FR‑4 board, natural convection cooling, lead‑free soldering, 50 % copper coverage, 1.6 mm thickness and 4 × 0.8 mm through‑holes.
How does ambient temperature affect the USP‑3 power dissipation?
Power dissipation decreases as ambient temperature rises; for example, at 25 °C the device dissipates about 1000 mW, while at 85 °C it dissipates about 400 mW.