This document introduces the power dissipation of USPN-4, including the power dissipation at 85℃ and 105℃
This document provides measured power‑dissipation data for the TOIREX USPN‑4 component. The data were obtained with the device mounted on a 40 × 40 mm FR‑4 board, copper covering 50 % of both front and back sides, and four copper blocks each connected to a terminal.
The tables show how the maximum junction temperature (Tj = 125 °C) varies with ambient temperature at two reference points (85 °C and 105 °C). The values can be used as reference when designing boards that incorporate the USPN‑4.
| Board dimensions | 40 x 40 mm |
|---|---|
| Copper coverage | 50% front, 50% back |
| Material | Glass Epoxy (FR‑4) |
| Package terminals | 4 |
| Through‑hole size | 4 x 0.8 mm |
A 40 × 40 mm board (1600 mm²) was used.
The USPN‑4 package has four terminals.