This file provides information about USP-2B02 Reel product, including specifications and dimensions
This one‑page datasheet presents the power‑dissipation characteristics of the TOIREX USP-2B02 when mounted on a printed circuit board. The measurement conditions are detailed, including board size, copper area, material, thickness, ambient cooling method, and lead‑free soldering.
A table lists ambient temperature versus power dissipation (Pd) and thermal resistance. The data show how Pd decreases as temperature rises, providing reference values for designers using the component in different thermal environments.
| Board dimensions | 114.3 mm × 76.2 mm |
|---|---|
| Copper trace area | 74.2 mm × 74.2 mm |
| Board material | Glass Epoxy (FR‑4) |
| Board thickness | 1.6 mm |
| Ambient cooling condition | Natural convection |
| Soldering type | Lead‑free (Pb‑free) |
The data were taken with the device mounted on a 114.3 mm × 76.2 mm board, copper traces covering 74.2 mm × 74.2 mm, FR‑4 material, 1.6 mm thickness, natural‑convection ambient, and lead‑free soldering.