Key facts
- Manuals
- 14
- Models
- 4
- Languages
- EN
- Last added
- 2012-03-19
TOIREX models by category
Featured TOIREX manuals
TOIREX USP-4D Datasheet
This document provides power‑dissipation reference data for the TOIREX USP-4D component. The measurements were taken under defined board and environmental conditions, including a FR‑4 substrate, lead‑free construction, and natural convection.
The data table shows how ambient temperature influences the dissipation, with values such as 650 mW at 25 °C and 260 mW at 85 °C. Additional details on board dimensions, copper coverage, and material thickness are also included.
Covers: Power Dissipation · Measurement Condition (Reference data) · Power Dissipation vs. Ambient temperature
TOIREX USPN-4 Power Dissipation Datasheet
This document provides measured power‑dissipation data for the TOIREX USPN‑4 component. The data were obtained with the device mounted on a 40 × 40 mm FR‑4 board, copper covering 50 % of both front and back sides, and four copper blocks each connected to a terminal.
The tables show how the maximum junction temperature (Tj = 125 °C) varies with ambient temperature at two reference points (85 °C and 105 °C). The values can be used as reference when designing boards that incorporate the USPN‑4.
Covers: Measurement Condition (Reference data) · Power Dissipation vs. Ambient Temperature (85°C) · Power Dissipation vs. Ambient Temperature (105°C)
TOIREX USP-3 Power Dissipation Datasheet
This one‑page document provides power dissipation values for the TOIREX USP-3 component measured on a standard board. The data are intended as reference for designers using the part in similar mounting conditions.
Measurements were taken with the device mounted on a 40 × 40 mm FR‑4 board, copper covering 50 % of the area, 1.6 mm thickness, and lead‑free solder. Ambient temperature ranged from 25 °C to 125 °C, with a reported thermal resistance of 100 °C/W and a maximum junction temperature of 125 °C.
Covers: Power Dissipation · Measurement Condition · Power Dissipation vs. Ambient Temperature
TOIREX USP-3 Power Dissipation Datasheet
This one‑page datasheet provides the power‑dissipation characteristics of the TOIREX USP‑3 device. It lists the reference measurement conditions, including board size, material, copper coverage, and mounting method.
The document includes a table that relates ambient temperature to power dissipation (Pd) and thermal resistance, showing how the device’s dissipation varies from 25 °C up to 125 °C.
Covers: Power Dissipation · Measurement Conditions · Power Dissipation vs Ambient Temperature
Latest TOIREX manuals
TOIREX USP-4D Datasheet
Datasheet 1 pages · 142 KB · ENPower dissipation data for the TOIREX USP-4D under various ambient temperatures and board conditions.
TOIREX USP-4 Manual
This document is about the packaging information and reference pattern layout dimensions of USP-4.
TOIREX USPN-4 Power Dissipation Datasheet
Datasheet 2 pages · 48 KB · ENPower dissipation specifications for the TOIREX USPN-4 component under various mounting conditions.
TOIREX USP-4 Reel Manual
This document is the introduction document of 1645 Tapeing Specifications, which introduces USP-4 Reel's Tapeing Specifications.
TOIREX USP-3 Manual(2)
Specifications of USP-3 series products, including product type, product size, product quantity and other information
TOIREX USP-3 Power Dissipation Datasheet
Datasheet 1 pages · 46 KB · ENPower dissipation data for the TOIREX USP-3 under specified board mounting conditions.
TOIREX USP-3 Power Dissipation Datasheet
Datasheet 1 pages · 46 KB · ENPower dissipation data for the TOIREX USP-3 under specified board mounting conditions.
TOIREX USP-2B02 Manual(2)
This is the packaging information and reference pattern layout dimensions of the USP-2B02 product
USP-2B02 Power Dissipation Datasheet
Datasheet 1 pages · 141 KB · ENPower dissipation data for the USP-2B02 under specified board mounting conditions.
TOIREX USP-2B02 Power Dissipation Datasheet
Datasheet 1 pages · 141 KB · ENPower dissipation specifications for the TOIREX USP-2B02 under various ambient temperatures and board mounting conditions.
TOIREX USP-2B01 Manual(2)
This document describes the taping specifications of USP-2B01 Reel, including unit dimensions, quantity per reel, device orientation, and standard feed direction.
TOIREX USP-2B01 Power Dissipation Data Sheet
Datasheet 1 pages · 141 KB · ENPower dissipation specifications for the TOIREX USP-2B01 under various ambient temperatures and board conditions.
TOIREX USP-2B01 Datasheet
Datasheet 1 pages · 141 KB · ENPower dissipation specifications for the TOIREX USP-2B01 under defined board mounting conditions.
TOIREX USP-12B01 Packaging Information
Datasheet 1 pages · 93 KB · ENPackaging dimensions and reference pattern layout for the TOIREX USP-12B01 component.
Which document do I need?
Datasheet
Ratings, dimensions and ordering codes, for selection and design work.
Questions answered in TOIREX manuals
What measurement conditions were used for the USP-4D power‑dissipation data?
The data were measured on a FR‑4 board with 1.6 mm thickness, copper traces covering 50 % of the area, lead‑free construction, through‑hole mounting, natural convection, and dimensions of 40 mm × 40 mm.
From: TOIREX USP-4D Datasheet
What board size was used for the power‑dissipation measurements?
A 40 × 40 mm board (1600 mm²) was used.
How many terminals does the USPN‑4 package have?
The USPN‑4 package has four terminals.
What are the measurement conditions for the USP‑3 power‑dissipation data?
The data were taken with the device mounted on a 40 × 40 mm FR‑4 board, natural convection cooling, lead‑free soldering, 50 % copper coverage, 1.6 mm thickness and 4 × 0.8 mm through‑holes.
How does ambient temperature affect the USP‑3 power dissipation?
Power dissipation decreases as ambient temperature rises; for example, at 25 °C the device dissipates about 1000 mW, while at 85 °C it dissipates about 400 mW.
What are the measurement conditions for the USP-2B02 power dissipation data?
The data were taken with the device mounted on a board, using natural convection cooling, lead‑free soldering, a board size of 114.3 mm × 76.2 mm, copper traces covering 74.2 mm × 74.2 mm, FR‑4 material and a thickness of 1.6 mm.