Given the power dissipation data of USP-4D and the measurement conditions, including ambient temperature, ambient type, PCB size, PCB material, PCB thickness, PCB hole, etc.
This document provides power‑dissipation reference data for the TOIREX USP-4D component. The measurements were taken under defined board and environmental conditions, including a FR‑4 substrate, lead‑free construction, and natural convection.
The data table shows how ambient temperature influences the dissipation, with values such as 650 mW at 25 °C and 260 mW at 85 °C. Additional details on board dimensions, copper coverage, and material thickness are also included.
| Dimensions | 40 mm × 40 mm |
|---|---|
| Copper trace coverage | 50 % of board area |
| Board material | Glass Epoxy (FR‑4) |
| Board thickness | 1.6 mm |
| Lead‑free | Yes |
The data were measured on a FR‑4 board with 1.6 mm thickness, copper traces covering 50 % of the area, lead‑free construction, through‑hole mounting, natural convection, and dimensions of 40 mm × 40 mm.