This document provides power dissipation data for the USP-2B01, including power dissipation values under different conditions and their relationship with ambient temperature.
This document provides reference power‑dissipation data for the TOIREX USP‑2B01 device. The values are measured under defined board‑mount conditions and are intended for use as design reference.
Measurements were taken with the device mounted on a 114.3 mm × 76.2 mm FR‑4 board, copper area 74.2 mm × 74.2 mm, 1.6 mm thickness, lead‑free soldering, and natural convection cooling. Power dissipation versus ambient temperature is listed, with a maximum junction temperature of 125 °C.
| Board dimensions | 114.3 mm × 76.2 mm |
|---|---|
| Copper trace area | 74.2 mm × 74.2 mm |
| Board material | Glass Epoxy (FR‑4) |
| Board thickness | 1.6 mm |
| Maximum junction temperature (Tjmax) | 125 °C |
The device was mounted on a board (114.3 mm × 76.2 mm, FR‑4, 1.6 mm thick) with copper traces covering 74.2 mm × 74.2 mm, using lead‑free soldering and natural convection cooling.
The maximum junction temperature is 125 °C.