USP-3 Packaging Information / Reference Pattern Layout Dimensions
This one‑page datasheet provides the power‑dissipation characteristics of the TOIREX USP‑3 device. It lists the reference measurement conditions, including board size, material, copper coverage, and mounting method.
The document includes a table that relates ambient temperature to power dissipation (Pd) and thermal resistance, showing how the device’s dissipation varies from 25 °C up to 125 °C.
| Board dimensions | 40 x 40 mm |
|---|---|
| Copper coverage | 50% of board area |
| Board material | Glass Epoxy (FR‑4) |
| Board thickness | 1.6 mm |
| Through‑hole size | 4 × 0.8 mm |
| Maximum junction temperature | 125 °C |
The data were taken with the device mounted on a 40 × 40 mm FR‑4 board, natural convection cooling, lead‑free soldering, 50 % copper coverage, 1.6 mm thickness and 4 × 0.8 mm through‑holes.
Power dissipation decreases as ambient temperature rises; for example, at 25 °C the device dissipates about 1000 mW, while at 85 °C it dissipates about 400 mW.