Key facts
- Brand
- TOIREX
- Model
- USP-2B02
- Documents
- 3
- Languages
- EN
- Last added
- 2012-03-19
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TOIREX USP-2B02 Manual(2)
User Manual
This is the packaging information and reference pattern layout dimensions of the USP-2B02 product
Read onlineTOIREX USP-2B02 specifications
| Board dimensions | 114.3 mm x 76.2 mm |
|---|---|
| Copper trace area | 74.2 mm x 74.2 mm |
| Board material | Glass Epoxy (FR-4) |
| Board thickness | 1.6 mm |
| Soldering type | Lead (Pb) free |
| Cooling method | Natural convection |
All TOIREX USP-2B02 documents by type
User Manual 3
Day-to-day operation, settings and troubleshooting. Start here if the product is already set up.
Datasheet 2
Ratings, dimensions and ordering codes, for selection and design work.
Questions answered in these manuals
What are the measurement conditions for the USP-2B02 power dissipation data?
The data were taken with the device mounted on a board, using natural convection cooling, lead‑free soldering, a board size of 114.3 mm × 76.2 mm, copper traces covering 74.2 mm × 74.2 mm, FR‑4 material and a thickness of 1.6 mm.
What measurement conditions were used for the USP-2B02 power‑dissipation data?
The data were taken with the device mounted on a 114.3 mm × 76.2 mm board, copper traces covering 74.2 mm × 74.2 mm, FR‑4 material, 1.6 mm thickness, natural‑convection ambient, and lead‑free soldering.