This page describes the power dissipation data of SOT-26 package, including measurement conditions and the relationship between power dissipation and ambient temperature
This document provides reference power‑dissipation values for the SOT‑26 package manufactured by Torex. The data are intended for use as a design reference when the device is mounted on a standard FR‑4 board.
Measurements were taken on a 40 mm × 40 mm board with 50 % copper coverage, natural convection cooling, and lead‑free solder. The table lists power dissipation and thermal resistance at various ambient temperatures, with a maximum junction temperature of 125 °C.
| Maximum junction temperature (Tj max) | 125 °C |
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The device was mounted on a 40 mm × 40 mm FR‑4 board with 50 % copper coverage, natural convection cooling, lead‑free solder, and measured under ambient temperature conditions.
The maximum junction temperature (Tj max) is specified as 125 °C.