This document provides power dissipation data for the SOT-26W package, including measurement conditions, thermal resistance, and the relationship between power dissipation and ambient temperature.
This one‑page datasheet presents power dissipation values for the Torex SOT‑26W MOSFET package. The data are intended as reference information when the device is mounted on a board with the conditions described below.
Measurements were taken on a 40 × 40 mm FR‑4 evaluation board (50 % copper coverage, 1.6 mm thickness) with natural convection cooling and lead‑free soldering. Power dissipation values are listed for ambient temperatures from 25 °C to 125 °C together with the corresponding thermal resistance.
| Maximum Junction Temperature (Tj max) | 125 °C |
|---|
The datasheet specifies a maximum junction temperature of 125 °C.