This document is about the power dissipation data of SOT-25, including the power dissipation and thermal resistance under different ambient temperatures.
This document provides reference power‑dissipation data for the SOT‑25 surface‑mount package. The data are intended for design engineers to estimate thermal performance when the device is mounted on a standard FR‑4 board.
Measurements were taken on a 40 × 40 mm glass‑epoxy (FR‑4) board with 50 % copper coverage, using natural convection and lead‑free soldering. Tables list power‑dissipation (mW) and thermal‑resistance (℃/W) at ambient temperatures of 25 °C, 85 °C, 105 °C and up to a junction temperature of 150 °C.
| Power Dissipation at 105 °C | 120 mW |
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