This document introduces the power dissipation of SOT-223, including measurement conditions, and the relationship between power dissipation and ambient temperature.
This datasheet presents reference power‑dissipation values for the SOT-223 surface‑mount package. The data are intended for designers evaluating thermal performance in different ambient environments.
Measurements were taken on a 40 × 40 mm board with 50 % copper coverage, using natural convection and a lead‑free solder. The board material is FR‑4 (1.6 mm thick) and the package heat‑sink is tied to the copper traces. Thermal resistance and power‑dissipation curves versus ambient temperature are included.
| Maximum Junction Temperature (Tj max) | 125 °C |
|---|---|
| Board dimensions used for measurement | 40 × 40 mm |
| Copper coverage on board | 50 % of board area |
The maximum junction temperature is 125 °C.
A 40 × 40 mm board was used.