Introduces the power dissipation data for SOP-8
This document presents reference power‑dissipation data for the SOP‑8 package. The values are intended for use as reference under the described measurement conditions.
Measurements were performed with the device mounted on a 40 mm × 40 mm FR‑4 board, copper covering 50 % of the area, 1.6 mm thickness, and natural convection cooling. The table lists power dissipation (mW) and thermal resistance (℃/W) at ambient temperatures of 25 ℃ and 85 ℃, with a maximum junction temperature of 125 ℃.
| Board dimensions | 40 mm × 40 mm (1600 mm² per side) |
|---|---|
| Copper coverage | 50 % of board area |
| Board material | Glass Epoxy (FR‑4) |
| Board thickness | 1.6 mm |
| Maximum junction temperature (Tjmax) | 125 ℃ |
The device is mounted on a 40 mm × 40 mm FR‑4 board with 50 % copper coverage, 1.6 mm thickness, under natural convection and lead‑free soldering.