FEATURES A cost-effective means of upgrading to SOIC without changing your PCB layout Available on 0.300 [7.62] centers. Consult Data Sheet 18011 for Adapters on 0.400[10.16] or 0.600 [15.24] centers
This document is a datasheet for the Aries 35W000 Series SOIC-to-DIP Adapter. It describes the product as a cost-effective means of upgrading to SOIC packages without changing the PCB layout. The adapter is available on 0.300 [7.62] centers, with references to other data sheets for different center spacings.
| Pins Material | Brass 360 1/2-hard per UNS C36000 ASTM-B16-00 |
|---|---|
| Pin Plating | Sn/Pb 93/7 over 100u Ni per SAE AMS-QQ-N-290 |
| Operating Temperature | 221°F [105°C] |
| Suggested PCB Hole Size | 0.028 +0.003 dia. |
It provides a cost-effective means of upgrading to SOIC without changing your PCB layout.
The adapter operates at 221°F [105°C].