FEATURES A cost-effective means of upgrading to SOIC without changing your PCB layout ?Available on 0.300 [7.62] centers. Consult Data Sheet 18011 for Adapters on 0.400 [10.16] or 0.600 [15.24] centers
This document provides technical specifications for the Aries Series 350000-10-HT High-Temperature SOIC-to-DIP Adapter. It is designed as a cost-effective solution to upgrade components without altering existing PCB layouts, available in various pin configurations including 8, 14, 16, 18, 20, and 24 pins.
The adapter features a board made of 0.062 inch thick Polyimide with Tg 260°C and 1-oz copper traces on both sides. Pins are constructed from brass (UNS C36000) plated with Sn/Pb over Nickel, supporting an operating temperature up to 200°C maximum.
| Board Material | 0.062 inch thick Polyimide, Tg 260°C with 1-oz. Cu traces, both sides |
|---|---|
| Pins Material | Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M |
| Pin Plating | 200p [5.08] Sn/Pb 93/7 over 100 [2.54] Ni |
| Operating Temperature | 200°C max. |
It provides a cost-effective means of upgrading to SOIC without changing your PCB layout.
The standard model is available on 0.300 [7.62] centers.