Aries 350000 Series SOJ/SOIC-to-DIP Adapter Datasheet

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Aries 350000 Series SOJ/SOIC-to-DIP Adapter Datasheet - cover page
Brand
Aries
Category
Adapter
Document type
Datasheet
Language
English
Pages
2
File format
PDF
File size
327 KB
Published
20 March, 2014
Updated
25 September, 2023
MD5 checksum
1DD0134241AEDC5CDF3788A6DFA934DA

About this manual

This document provides a datasheet for the Aries 350000 Series, which offers a cost-effective method for upgrading SOJ or SOIC components to DIP packages without altering the existing PCB layout. The adapters are available on 0.300 [7.62] centers, with options for 0.400 or 0.600 centers available via a separate data sheet.

What's inside

  • Features
  • General Specifications
  • Mounting Considerations
  • Ordering Information
  • Customization

Specifications

Board Material0.062 [1.58] thick FR-4, UL94V-0, with 1-oz. Cu traces, both sides
Pins MaterialBrass 360 1/2-hard per UNS C36000 ASTM-B16-00
Pin Plating200μ [5.08μ] min. Sn per ASTM B 545 Type-1 or Sn/Pb 93/7 per ASTM B 545 over 100μ [2.54μ] Ni per SAE-AMS-QQ-N-290
Operating Temperature221°F [105°C]
Suggested PCB Hole Size0.028 ±0.003 [0.71 ±0.08] dia.

Frequently asked questions

What is the Aries 350000 adapter used for?

It is a cost-effective means of upgrading to SOJ or SOIC without changing your PCB layout.

What is the operating temperature of the adapter?

The adapter operates at 221°F [105°C].

What is the suggested PCB hole size for mounting?

The suggested PCB hole size is 0.028 ±0.003 [0.71 ±0.08] dia.

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