FEATURES
This document provides a datasheet for the Aries 350000 Series, which offers a cost-effective method for upgrading SOJ or SOIC components to DIP packages without altering the existing PCB layout. The adapters are available on 0.300 [7.62] centers, with options for 0.400 or 0.600 centers available via a separate data sheet.
| Board Material | 0.062 [1.58] thick FR-4, UL94V-0, with 1-oz. Cu traces, both sides |
|---|---|
| Pins Material | Brass 360 1/2-hard per UNS C36000 ASTM-B16-00 |
| Pin Plating | 200μ [5.08μ] min. Sn per ASTM B 545 Type-1 or Sn/Pb 93/7 per ASTM B 545 over 100μ [2.54μ] Ni per SAE-AMS-QQ-N-290 |
| Operating Temperature | 221°F [105°C] |
| Suggested PCB Hole Size | 0.028 ±0.003 [0.71 ±0.08] dia. |
It is a cost-effective means of upgrading to SOJ or SOIC without changing your PCB layout.
The adapter operates at 221°F [105°C].
The suggested PCB hole size is 0.028 ±0.003 [0.71 ±0.08] dia.