Aries 350000-11-RC SOIC-to-DIP Adapter Datasheet

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Aries 350000-11-RC SOIC-to-DIP Adapter Datasheet - cover page
Brand
Aries
Category
RoHS/WEEE-Compliant Adapter
Document type
Datasheet
Language
English
Pages
2
File format
PDF
File size
394 KB
Published
20 March, 2014
Updated
25 September, 2023
MD5 checksum
449A2947D302C324C14E1C37DC061F74

About this manual

This document provides a datasheet for the Aries 350000-11-RC RoHS/WEEE-Compliant Adapter. It describes the product as a cost-effective means of upgrading to SOJ or SOIC packages without changing the PCB layout. The adapter is available on 0.300 [7.62] centers, with options for 0.400 or 0.600 centers available upon consulting Data Sheet 18011.

What's inside

  • Features
  • General Specifications
  • Mounting Considerations
  • Dimensions
  • Ordering Information

Specifications

Board Material0.062 [1.58] thick FR-4 or IS410 per IPC4101A/26 with 1-oz. Cu traces, both sides
Pads FinishENIG (Immersion Au over Electroless Ni)
Pins MaterialBrass 360 1/2-hard per UNS C36000 ASTM-B16-00
Pin Plating10µ [2.54µ] min. Au per MIL-G-45204 over 100µ [2.54µ] min. Ni per SAE AMS-QQ-N-290
Operating Temperature105°C max.
Suggested PCB Hole Size0.028 ±0.003 [0.71 ±0.08] dia.

Frequently asked questions

What is the center spacing for the 350000-11-RC adapter?

The adapter is available on 0.300 [7.62] centers.

Can I get adapters for 0.400 or 0.600 centers?

Yes, consult Data Sheet 18011 for adaptors on 0.400 [10.16] or 0.600 [15.24] centers.

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