Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a leadless ultra small SOD882D (DFN1006D-2) Surface-Mounted Device (SMD) plastic package with visible and solderable side pads.
This document is a product data sheet for the NXP Semiconductors PMEG6002ELD, a planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier. The device features an integrated guard ring for stress protection and is encapsulated in a leadless ultra-small SOD882D (DFN1006D-2) Surface-Mounted Device plastic package with visible and solderable side pads.
The datasheet provides comprehensive technical specifications, including quick reference data for average forward current and reverse voltage. It details limiting values such as junction temperature and power dissipation under various mounting conditions (FR4 PCB or ceramic PCB). Additionally, it includes thermal characteristics, electrical characteristics like forward voltage and reverse recovery time, and typical performance graphs illustrating relationships between current, voltage, and temperature.
| Package type | SOD882D (DFN1006D-2) |
|---|---|
| Junction temperature (Tj) | -55 to 150 °C |
The device is encapsulated in a leadless ultra-small SOD882D (DFN1006D-2) Surface-Mounted Device plastic package.
Yes, the PMEG6002ELD is AEC-Q101 qualified.