NXP PSMN2R4-30MLD MOSFET Datasheet

Logic level gate drive N-channel enhancement mode MOSFET in LFPAK33 package. NextPowerS3 portfolio utilising NXP


NXP PSMN2R4-30MLD MOSFET Datasheet - cover page
Brand
NXP
Category
MOSFET
Document type
Datasheet
Language
English
Pages
14
File format
PDF
File size
302 KB
Published
30 May, 2014
Updated
25 September, 2023
MD5 checksum
6BB82894104B613E09F9ECFDC0FD4685

About this manual

This document is a product datasheet for the NXP PSMN2R4-30MLD, a logic level gate drive N-channel enhancement mode MOSFET. It utilizes NXP's unique NextPowerS3 technology, which employs a Schottky-like diode structure to deliver high efficiency and low spiking performance without the high leakage current issues found in traditional integrated Schottky MOSFETs. The device is housed in an LFPAK33 (SOT1210) package and is optimized for 4.5 V gate drive applications.

What's inside

  • General description
  • Features and benefits
  • Applications
  • Quick reference data
  • Pinning information
  • Ordering information
  • Limiting values
  • Thermal characteristics
  • Characteristics
  • Source-drain diode

Specifications

Junction temperature-55 to 175 °C

Frequently asked questions

What technology is used in the PSMN2R4-30MLD?

The device utilizes NXP's unique NextPowerS3 technology, which provides Schottky-like performance with low leakage current.

What is the gate drive voltage optimization?

The MOSFET is optimized for a 4.5 V gate drive.

What is the maximum junction temperature?

The maximum junction temperature is 175 °C.

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