Semikron has introduced a new technology and logistics service that integrates the processing of thermal coatings for power modules. They use automated screen printing and statistical process control to ensure consistent quality of the coatings. This service is available for the MiniSKiiP® product series, providing efficient cooling and reliability.
SEMIKRON offers a dedicated heat‑coating service for power semiconductor modules. The service integrates automatic screen‑printing, specialized bubble‑pack packaging, and statistical process control to ensure uniform coating thickness and reliable performance.
The process achieves a thickness tolerance of ±10 µm, a defect rate of only 60 per million units, and allows coated modules to be stored in patented bubble packs for up to 18 months. The service is available for MiniSKiiP (CIB up to 100 A and six‑component up to 150 A) and will be expanded to the SEMIPACK series. This manual is written in Chinese.
| Coating thickness tolerance | ±10 µm |
|---|---|
| Defect rate | 60 per 1,000,000 units |
| Maximum storage life in bubble pack | 18 months |
| Processing capability factor | 1.33 |
The coating process can achieve a thickness tolerance of ±10 µm.
Coated modules can be stored in the patented bubble pack for up to 18 months.
Only 60 out of every 1 million modules fail to meet the specified tolerance.
Both the CIB (up to 100 A) and six‑component (up to 150 A) MiniSKiiP modules are eligible.