Semikron B...C 3200-2200 Silicon-Bridge Rectifier Data Sheet

Features of the product:


Semikron B...C 3200-2200 Silicon-Bridge Rectifier Data Sheet - cover page
Brand
SEMIKRON
Category
Rectifier Diode
Document type
Datasheet
Language
English
Pages
2
File format
PDF
File size
172 KB
Published
08 May, 2012
Updated
30 September, 2023
MD5 checksum
2303EB8C21ED622E44B6090F748CF10A

About this manual

The B...C 3200-2200 is a silicon‑bridge rectifier with forward current ratings of 3.2 A (continuous) and 2.2 A (repetitive). It supports reverse voltages from 80 V up to 1000 V and complies with UL file no. E63532. The device can be soldered up to 260 °C for a maximum of 5 seconds.

Mechanically, the rectifier is supplied in a bulk plastic case measuring 32 × 5.6 × 17 mm and weighs approximately 7 g. Terminals are plated and solderable per IEC 68‑2‑20, and the component can be mounted in any position. The data sheet also provides absolute maximum ratings, forward voltage, leakage current, and typical characteristic curves.

What's inside

  • Features
  • Mechanical Data
  • Absolute Maximum Ratings
  • Electrical Characteristics
  • Dimensions
  • Graphs

Specifications

Forward Current3.2 A / 2.2 A
Reverse Voltage80 V to 1000 V
Maximum Solder Temperature260 °C (max 5 s)
Package Dimensions32 × 5.6 × 17 mm
Weight≈ 7 g
Maximum Averaged Forward Current2.2 A
Maximum Forward Voltage1.1 V
Maximum Leakage Current10 pA
Operating Junction Temperature Range-50 °C to +150 °C

Frequently asked questions

What is the forward current rating of the B...C 3200-2200?

The device is rated for a continuous forward current of 3.2 A and a repetitive forward current of 2.2 A.

What reverse voltage can the rectifier withstand?

It can handle reverse voltages ranging from 80 V up to 1000 V.

What are the mechanical dimensions and weight of the component?

The plastic case measures 32 × 5.6 × 17 mm and the part weighs about 7 g.

What is the maximum soldering temperature allowed?

The maximum soldering temperature is 260 °C for up to 5 seconds.

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