SEMIKRON Manuals

Key facts

Manuals

24

Models

2

Languages

ZH

Last added

2012-06-12

SEMIKRON models by category

Featured SEMIKRON manuals

Semikron SKiiP® 4 Intelligent Power Module Product Introduction

Product Leaflet 12 pages · 1.6 MB · ZH

The SKiiP® 4 is a next‑generation intelligent power module (IPM) that uses sintered chip connections and a pressure‑contact system, giving it a longer lifetime and the ability to operate at higher temperatures. It integrates a heat sink, power module, driver and protection sensors in a compact package, and offers versions for 1200 V and 1700 V.

Designed for high‑power renewable‑energy and industrial applications, the module supports output currents up to 3600 A, a 33 % increase in power density over the SKiiP® 3, and can be used in wind turbines, solar inverters, traction drives, elevators and large‑scale industrial drives. The sintered connection provides a thin silver layer with thermal resistance far lower than welded joints, enabling reliable operation under extreme thermal cycling. This manual is written in Chinese.

Covers: Technical Features · Packaging and Connection Technology · Power Density and Current Rating · Voltage and Current Specifications · Gate Driver Concept · Reliability Testing

Semikron AN-7004 IGBT Driver Application Note

Application Note 8 pages · 1.5 MB · ZH

The document provides methods for determining the performance of IGBT drivers used in power electronic systems. It covers gate‑charge curves, measurement techniques, driver output‑power calculations and selection criteria for suitable drivers.

The note also introduces the free DriverSel software tool for simplifying driver calculations and includes symbols, terminology and reference material for further study. This manual is written in Chinese.

Covers: Gate Charge Curve · Measuring Gate Charge · Determining Gate Charge · Driver Output Power · Gate Current · Peak Gate Current

Semikron AN-7003 Gate Resistor Application Note

Application Note 8 pages · 2.5 MB · ZH

The guide provides design principles for using gate resistors (RG) to control IGBT switching. It covers the impact of RG on switching time, loss, dv/dt, di/dt, EMI and voltage spikes, and offers calculation methods for optimal resistor values.

Key sections include IGBT switching characteristics, free‑wheeling diode behavior, driver output stage, gate‑resistor calculation, minimum gate impedance, power dissipation, peak‑power capability, resistor types, layout recommendations, troubleshooting, and a glossary of symbols and terms. This manual is written in Chinese.

Covers: IGBT Switching Characteristics · Freewheeling Diode Switching Characteristics · Driver Output Stage · Gate Resistor Calculation · Minimum Gate Impedance – Maximum Gate Peak Current · Power Dissipation

SEMIKRON MiniSKiiP & SEMIPACK Heat Coating Service Manual

Product Leaflet 1 pages · 525 KB · ZH

SEMIKRON offers a dedicated heat‑coating service for power semiconductor modules. The service integrates automatic screen‑printing, specialized bubble‑pack packaging, and statistical process control to ensure uniform coating thickness and reliable performance.

The process achieves a thickness tolerance of ±10 µm, a defect rate of only 60 per million units, and allows coated modules to be stored in patented bubble packs for up to 18 months. The service is available for MiniSKiiP (CIB up to 100 A and six‑component up to 150 A) and will be expanded to the SEMIPACK series. This manual is written in Chinese.

Covers: Service Overview · Heat Coating Process · Quality Control and Tolerance · Packaging and Storage · MiniSKiiP Series Application · Future Expansion to SEMIPACK

Latest SEMIKRON manuals

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  This datasheet introduces the basic information of BZV58C10, including functions, packages, pins, pin functions, current voltage characteristics, impedance characteristics, temperature characteristics, and interface characteristics.

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  This document introduces the features and characteristics of SEMITRANS® 2 series IGBTs, including the power, voltage, current, and package information.

• SEMIKRON SKCD 06 C 120 I HD handbook

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• SEMIKRON P600 A...P600 S Data Sheet

• SEMIKRON SM 4001...SM 4007 Data Sheet

  The SM4001 is a Schottky diode produced by NEXPERIA. It is a 6.2V, 1A Schottky diode with a breakdown voltage of 60V and a maximum reverse bias current of 25mA. The maximum reverse leakage current is 10uA, the forward current transfer ratio is 100%, and the reverse recovery time is 500ns. It is mainly used in switch, rectifier, and detector circuits.

• SEMIKRON B 40FD ... B 380FD handbook

  The document describes the features and characteristics of rectifiers, including parameters such as input and output voltage and current. It also provides a supplier search function.

• SEMIKRON SKN 26 Data Sheet

  SKN SKR series high-performance power supply modules are designed for switching power supplies. They are available in a wide range of power and voltage ratings.

• SEMIKRON B ...C 3200-2200 Data Sheet

  Features of the product:

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