This document provides PCB designers with a set of guidelines for successful board mounting of Atmel® surface mount packages.
This document provides a set of guidelines for the successful board mounting of Atmel surface mount packages. It covers the solder reflow process, including typical process flows and temperature profiles, emphasizing that these are general guidelines derived from IPC standards and not direct recommendations for board design. The text notes that Atmel does not take legal liability for the information provided and advises referring to the IPC website for more details on board design and processing.
| Time Above Liquidus | 60 sec to 150 sec |
|---|---|
| Ramp Rate (Preheat) | 3°C per second or lower |
The paste volume should be around 80% to 90% of the stencil aperture volume to indicate a good paste release.
No, Atmel does not recommend a specific profile because the actual reflow profile depends on the solder paste being used and the board density.
It is recommended that an array of thermal vias should be incorporated at a 1.00mm to 1.20mm pitch.