This document provides the dimensional information of M24.173B 24 LEAD THIN SHRINK SMALL OUTLINE EXPOSED PAD PLASTIC PACKAGE.
This document provides dimensional drawings and specifications for the M24.173B package, a 24-lead Thin Shrink Small Outline Exposed Pad Plastic Package (EPTSSOP). The data includes gauge measurements in inches and millimeters with specific notes on tolerances, mold flash, and terminal definitions.
The M24.173B package has 24 terminal positions.
The length 'L' represents the terminal length required for soldering to a substrate.