This document introduces the specifications of AMPMODU Interconnection System Wire-to-Board Products, including wire size, plating, post length and more.
![Tyco AMPMODU Interconnection System Wire-to-Board .100 [2.54] Centerline Products Handbook - cover page](/uploads/covers/d9/d917471ac257c0631dc0a690702896b0.jpg)
The AMPMODU Interconnection System from Tyco Electronics offers a family of wire‑to‑board and wire‑to‑wire connectors that use .025 [0.64] sq. post technology on a .100 [2.54] mm centerline grid. The handbook details the various housing styles, contact options, and compatible tooling for both manual and machine‑applied termination.
Key features include dual‑cantilever beam receptacle contacts, interchangeable crimp and snap‑in pins, high‑temperature and high‑pressure options, and a range of plating choices (gold, tin, nickel). Electrical and environmental specifications such as current rating, resistance, dielectric withstand, operating temperature, vibration, and shock limits are also listed.
| Contact Current Rating | 3 A per single contact in free air |
|---|---|
| Contact Resistance (max) | 15 mΩ |
| Dielectric Withstanding Voltage (sea level) | 600 VAC rms |
| Dielectric Withstanding Voltage (70 000 ft) | 225 VAC rms |
| Insulation Resistance (min) | 5 000 MΩ |
| Operating Temperature | -65 °C to +105 °C |
| Vibration (gold contacts) | 15 G |
| Physical Shock | 50 G |
Each single contact can carry up to 3 amperes in free air.
The system is rated for temperatures from –65 °C up to +105 °C.
They can withstand 600 VAC rms at sea level and 225 VAC rms at 70 000 ft altitude.
The minimum insulation resistance is 5 000 megohms.