The document is about HP1 series metal case, including TO-3 or Stud Mount devices, and provides mounting methods, including natural convection and fan convection.
The HP1 Series from CTS offers metal‑case, case‑mounted heat sinks for single, dual, and triple TO‑3 or TO‑66 devices. Technical data includes thermal resistance values, derating guidelines, and performance curves for different fan speeds and mounting configurations.
The document lists ordering part numbers, hole pattern numbers for mounting, and detailed specifications such as thermal resistance ranges and derating per watt. It also provides contact information for CTS and revision details.
| Thermal Resistance (single TO‑3) | 0.1‑0.3 °C/W |
|---|---|
| Thermal Resistance (single TO‑66) | 0.5‑0.7 °C/W |
| Derate (unplated, natural convection) | 1.0 °C/Watt |
| Derate (dual TO‑66, unplated) | 2.0 °C/Watt per device |
| Derate (three TO‑66, unplated) | 3.0 °C/Watt per device |
The thermal resistance is 0.1‑0.3 °C/W when using joint compound.
For dual TO‑66 devices the derate is 2.0 °C per watt per device for unplated parts in natural convection.
The part number is HP1-TO66-CB for the TO‑66 version with a 2N3054 transistor and dissipator.
Hole pattern no. 1 accommodates TO‑3 devices.